Optical sensor package module and manufacturing method thereof

ABSTRACT

An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The instant disclosure relates to an optical sensor package module andthe manufacturing method thereof; in particular, to an optical sensorpackage module having sensor chip and the manufacturing method thereof.

2. Description of Related Art

Conventional optical sensor chips are usually designed to receive orsense a light with a specific wavelength range according to theapplication fields thereof. For example, the optical sensor chip, whichmay be implemented in the fingerprint recognition device or the irisrecognition device, receives an infrared light reflected by an object,such as a user's finger or iris, so that the user's identification canbe confirmed.

However, when the device equipped with the optical sensor chip is usedoutdoor under sunlight, the ambient light containing light of differentwavelengths can also be received by the optical sensor chip and resultin signal interference. That is to say, the influx of the ambient lightwould be far greater than that of the signal light entering the opticalsensor chip. As such, the signal-to-noise ratio is reduced, therebyreducing the detection accuracy.

SUMMARY OF THE INVENTION

One of the objects of the instant disclosure is to provide an opticalsensor package module. By disposing the shielding assembly having anaperture on the sensor chip during the package process to expose asubset of pixels of the sensor chip, the influx of the ambient lightonto the sensor chip can be reduced so as to increase thesignal-to-noise ratio.

In order to achieve the aforementioned objects, according to anembodiment of the instant disclosure, an optical sensor package moduleis provided. The optical sensor package module includes a substrate, asensor chip and a shielding assembly. The sensor chip is disposed on thesubstrate and includes an array of pixels located at a top side thereoffor receiving light. The shielding assembly is disposed on the substrateand surrounds the sensor chip for limiting influx of light onto thesensor chip, and the shielding assembly has a first aperture to exposeat least a first subset of the pixels that is configured to receivecorresponding light.

In order to achieve the aforementioned objects, according to anembodiment of the instant disclosure, a manufacturing method of anoptical sensor package module is provided. The manufacturing methodincludes the steps of disposing a sensor chip on a substrate, the sensorchip including an array of pixels located at a top side thereof forreceiving light; and disposing a shielding assembly having an apertureon the substrate to surround the sensor chip, the aperture being inalignment with the sensor chip to expose at least a first subset ofpixels that is configured to receive corresponding light.

To sum up, the optical sensor package module in accordance with theinstant disclosure can control a ratio between the influx of a signallight of a wavelength within a predetermined wavelength range and theinflux of the ambient light by disposing the shielding element, theshielding element having the aperture to expose the subset of pixelsthat is configured to receive the signal light. As such, most of theambient light can be filtered by the shielding element and thesignal-to-noise ratio of the optical sensor package module can besignificantly increased.

In order to further the understanding regarding the instant disclosure,the following embodiments are provided along with illustrations tofacilitate the disclosure of the instant disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a top view of an optical sensor package module inaccordance with an embodiment of the instant disclosure;

FIG. 2 shows a sectional view taken along line II-II of FIG. 1;

FIG. 3 shows a top view of part of an optical sensor package modulewithout the frame in accordance with another embodiment of the instantdisclosure;

FIG. 4 shows a top view of part of an optical sensor package modulewithout the frame in accordance with another embodiment of the instantdisclosure;

FIG. 5 shows a top view of an optical sensor package module inaccordance with another embodiment of the instant disclosure;

FIG. 6 shows a top view of an optical sensor package module inaccordance with another embodiment of the instant disclosure;

FIG. 7 shows a sectional view taken along line VII-VII of FIG. 6;

FIG. 8 shows a sectional view of the shielding assembly in accordancewith another embodiment of the instant disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The aforementioned illustrations and following detailed descriptions areexemplary for the purpose of further explaining the scope of the instantdisclosure. Other objectives and advantages related to the instantdisclosure will be illustrated in the subsequent descriptions andappended drawings. In reference to the disclosure herein, for purposesof convenience and clarity only, directional terms, such as, top,bottom, left, right, up, down, over, above, below, beneath, rear, front,distal, and proximal are used with respect to the accompanying drawings.Such directional terms should not be construed to limit the scope of theinvention in any manner. In addition, the same reference numerals aregiven to the same or similar components.

Please refer to FIG. 1 and FIG. 2. FIG. 1 shows a top view of a opticalsensor package module in accordance with an embodiment of the instantdisclosure, and FIG. 2 shows a sectional view taken along line II-II ofFIG. 1.

The optical sensor package module provided in the embodiment of theinstant disclosure can be implemented in different kinds of devices,such as a fingerprint recognition device, a sweat duct identificationdevice, an oximeter detector, a heartbeat sensor, an ambient lightsensor, or a proximity sensor. In the embodiment of the instantdisclosure, the optical sensor package module 1 includes a substrate 10,a sensor chip 11, and a shielding element 12.

The substrate 10 can be a metal plate, an insulating plate, or acomposite plate, in which the composite plate may be a printed circuitboard (PCB) or a flexible printed circuit (FPC). In the instantembodiment, the substrate 10 is a printed circuit board, the substrate10 has a plurality of traces (not shown in FIG. 1) embedded therein anda plurality of pads 100, 101 disposed thereon. The pads 100, 101 can bearranged according to the components, such as the sensor chip 11,disposed on the substrate 10.

Additionally, in the embodiment shown in FIG. 1, the top view of thesubstrate 10 has a basic rectangular shape, but the shape of thesubstrate 10 is not limited to the example provided herein. In anotherembodiment, the substrate 10 may have another geometric shape, such as acircular shape, an elliptical shape, a square shape, or a triangularshape.

The sensor chip 11 is disposed on the substrate 10 and electricallyconnected to the substrate 10 by wire bonding. Specifically, the sensorchip 11 has a top side 11 a and a bottom side 11 b opposite to the topside 11 a. The sensor chip 11 includes an array 110 of pixels forreceiving light and a wiring region 113 surrounding the array 110 of thepixels. Furthermore, both the array 110 of pixels and the wiring region113 are located at the top side 11 a of the sensor chip 11. A controlcircuit, which is electrically connected to the array 110 of pixels andnot shown in FIG. 1, has been laid out in the wiring region 113 toreceive the signal detected by the array 110 of pixels.

In the instant embodiment, the optical sensor package module 1 canfurther include a plurality of bonding wires 13 connected between thewiring region 113 and the pads 100 of the substrate 10 so that theelectrical connection between the sensor chip 11 and the substrate 10can be established. In another embodiment, the sensor chip 11 can beelectrically connected to the substrate 10 by flip-chip bonding. That isto say, as long as the electrical connection between the sensor chip 11and the substrate 10 can be established, the means for electricallyconnecting the sensor chip 11 to the substrate 10 are not limited to theexamples provided herein.

In the instant embodiment, the array 110 of pixels can be designed fordetecting the light of different wavelengths, such as visible light, orfor detecting the monochromatic light, such as infrared light, UV light,green light, or blue light. In one embodiment, the array 110 of pixelscan include a plurality of subsets of pixels for respectively detectinglights of different wavelengths. When the sensor chip 11 is implementedin a specific device, the sensor chip 11 is mainly used to receive lightof a specific wavelength. For example, the sensor chip 11, which isimplemented in the heartbeat sensor, is mainly used to detect greenlight or infrared light reflected by an object. In the instantdisclosure, the influx of the ambient light onto the array 110 of thepixels is limited by disposing the shielding assembly 12 having at leastone aperture on the substrate 10 so as to attenuate the interference ofthe ambient light. The structures of the shielding assembly 12 indifferent embodiments will be described in the following.

In one embodiment shown in FIG. 1 and FIG. 2, the shielding assembly 12includes a shielding element 120 and a frame 121. The shielding element120 is disposed on the sensor chip 11. Furthermore, the shieldingelement 120 has a first aperture h1 to expose at least a first subset110 a of the pixels that is configured to receive corresponding light.Specifically, a wavelength of the corresponding light falls within afirst predetermined wavelength range. For example, if the optical sensorpackage module 1 will be implemented in heartbeat sensor, the firstsubset 110 a of the pixels which is configured to receive green light orinfrared light is exposed through the first aperture h1. In oneembodiment, the first aperture h1 has a diameter ranging from 20 to 500μm. The diameter of the first aperture h1 can be adjusted according tothe practical demands.

Furthermore, other pixels of the sensor chip 11, which is configured toreceive the light of wavelength falling out of the first predeterminedwavelength range, are covered by the shielding element 120. Accordingly,most ambient light can be blocked by the shielding element 120 so thatthe signal interference can be reduced.

In one embodiment, the shielding element 120 can be fabricated bypunching or etching a metal sheet, which may be a copper sheet, analuminum sheet, or a stainless-steel sheet. In another embodiment, theshielding element 120 can be made of the other materials as long as thesame results can be achieved, and the instant disclosure is limited tothe example provided herein. Furthermore, a thickness of the shieldingelement 120 can range from 20 to 250 μm to reach a good compromisebetween fabrication convenience and opaqueness. In another embodiment,the shielding element 120 can be made of polycarbonate (PC) plastic.

The shielding element 120 is disposed on the sensor chip 11 by anadhesive structure 14. The adhesive structure 14 can be a continuousadhesive layer or have a plurality of substructures separated from eachother. Specifically, in the embodiment shown in FIG. 1 and FIG. 2, theadhesive structure 14 is the continuous adhesive layer covering thefirst subset 110 a of the pixels, the adhesive layer being transparentto the corresponding light of the first predetermined wavelength range.

Specifically, a liquid adhesive material can be coated on the array 110of the pixels or the shielding element 120 and then be cured so as tofasten the shielding element 120 to the sensor chip 11. During thecuring process, the adhesive material may apply a stress to the sensorchip 120 due to the hardness thereof and then result in the formation ofa crack on the sensor chip 11. Accordingly, in the instant embodiment,the adhesive structure 14 can be made of a material with a Shorehardness of less than 60 and a Young's modulus of less than 2000 MPa soas to prevent the formation of the crack. In another embodiment, theliquid adhesive material can be replaced with an adhesive tape.

In the instant embodiment, the adhesive structure 14 has a thickness ofless than 50 μm so that the corresponding light which the first subset110 a of pixels is configured to receive can pass through the adhesivestructure 14. That is to say, the material of the adhesive structure 14can have a transparency of at least 90% at the wavelength falling withinthe first predetermined wavelength range.

Please refer to FIG. 3, which shows a top view of a partial opticalsensor package module without the frame in accordance with anotherembodiment of the instant disclosure. In the embodiment shown in FIG. 3,the adhesive structure 14 can also be the adhesive layer interlayeredbetween the sensor chip 11 and the shielding element 120. In the instantembodiment, the adhesive layer has a through hole 14 h to expose thefirst subset 110 a of the pixels, the through hole 14 h corresponding tothe first aperture h1. That is to say, the diameter of the though hole14 h can be equal to or greater than that of the first aperture h1 sothat the first subset 110 a of the pixels are not covered by theadhesive structure 14. In the instant embodiment, it is not necessaryfor the adhesive structure 14 to be made of a material which istransparent to the corresponding light of the first predeterminedwavelength range.

Please refer to FIG. 4. FIG. 4 shows a top view of part of an opticalsensor package module without the frame in accordance with anotherembodiment of the instant disclosure. In the instant embodiment, theadhesive structure 14 disposed between the shielding element 120 and thesensor chip 11 has a plurality of substructures 140 separated from eachother. Furthermore, the substructures 140 do not cover the first subset110 a of the pixels. As shown in FIG. 4, the substructures 140 are indiscrete-particle form and respectively positioned at the corners of theshielding element 120. In another embodiment, each of the substructures140 can be in stripe form or in other shapes, and the shape of each ofthe substructures 140 is not limited in the instant disclosure.

Please refer to FIG. 1 and FIG. 2 again. In the embodiment of theinstant disclosure, the optical sensor package module 1 further includesa color filter 15 covering the first set 110 a of the pixels. As shownin FIG. 2, the color filter 15 is disposed between the adhesivestructure 14 and the sensor chip 12. In another embodiment, the colorfilter 15 can be disposed on the shielding element 120 and cover thefirst aperture h1. By disposing the color filter 15, the light with awavelength outside of the first predetermined wavelength range can befiltered so as to further increase the signal-to-noise ratio. In oneembodiment, the color filter 15 can include a glass (not shown in FIG.2) and a filter layer (not shown in FIG. 2) formed on the glass.However, in another embodiment, the color filter 15 can also be omittedaccording to practical demand.

Additionally, the shielding assembly 12 also includes the frame 121 anda shielding structure 122, and the frame 121 and the shielding structure122 are disposed on the substrate 10. The frame 121 includes a top plate121 a and a partition wall 121 b extending downward from the top plate121 a. Specifically, the frame 121 encloses the sensor chip 11 and thebonding wires 13 so that the sensor chip 11 and the bonding wires 13 canbe protected from damage. Moreover, the top plate 121 a has a lightreceiving opening h2 in alignment with the sensor chip 11 so as to allowthe light to enter the first subset 110 a of the sensor chip 11.Accordingly, the size of the light receiving opening h2 is greater thanthat of the first aperture h1.

The shielding structure 122 together with a part of the partition wall121 b forms a space S1. The space S1 can accommodate a passive chip,such as a light-emitting component. In the embodiment shown in FIG. 2,the optical package module 1 further includes a first light-emittingcomponent 16 for emitting light of a wavelength within the firstpredetermined wavelength range. The first light-emitting component 16 isdisposed on the substrate 10 and accommodated in the space S1. The firstlight-emitting component 16 can be an LED or a laser diode forgenerating a monochromatic light or a polychromatic light, such asvisible light, UV light, or infrared light.

Additionally, the first light-emitting component 16 is electricallyconnected to the substrate 10. Specifically, in the instant embodiment,the substrate 10 includes a switching control circuit, and the voltageinput terminal located at the top portion of the first light-emittingcomponent 16 can be electrically connected to the switching controlcircuit through the pad 101 by wire bonding. As such, the switchingcontrol circuit can control the on and off of the first light-emittingcomponent 16.

The partition wall 121 b and the shielding structure 122 can separatethe sensor chip 11 from the first light-emitting component 16.Specifically, the portion of the partition wall 121 b for defining thespace 51 can limit the light emission angle of the first light-emittingcomponent 16 to prevent the light generated by the first-emittingcomponent 16 from being directly received by the sensor chip 11.Accordingly, in the instant embodiment, only the light generated by thefirst-emitting component 16 and then reflected by the object, such as auser's finger or wrist, can be received by the first subset 110 a of thepixels. As such, the influx of the stray light (the ambient light or thelight which is not reflected by the object) onto the sensor chip 11 canbe reduced so that the signal-to-noise ratio can be significantlyincreased.

Please refer to FIG. 5. FIG. 5 shows a top view of an optical sensorpackage module in accordance with another embodiment of the instantdisclosure. In the instant embodiment, the optical sensor package module1 further includes a second light-emitting component 17 for emittinglight of a wavelength within a second predetermined wavelength. In oneembodiment, the second predetermined wavelength range and the firstpredetermined wavelength range partially overlap or do not overlap. Thatis to say, a central value of the first predetermined wavelength rangeis different from that of the second predetermined wavelength. Forexample, the first light-emitting component 16 can be used to generategreen light, and the second light-emitting component 17 can be used togenerate infrared light.

As shown in FIG. 5, the second light-emitting component 17 is disposedon and electrically connected to the substrate 10. In the instantembodiment, both the first and second light-emitting components 16, 17are accommodated in the space S1.

Furthermore, the shielding element 120 has a second aperture h2 toexpose a second subset 110 b of the pixels receiving light of wavelengthwithin a second predetermined wavelength range. A size of the secondaperture h2 can be different from or the same as that of the firstaperture h1 according to different situations. In one embodiment, thesecond aperture h2 has a smaller diameter than that of the firstaperture h1, such that the influx of the light emitted by the secondlight-emitting component 17 is less than that of the light emitted bythe first light-emitting component 16 onto the first sensor chip 11.

In other words, the influx of the light emitted by the firstlight-emitting component 16 and the influx of the light emitted by thesecond light-emitting component 17 can be adjusted by modifying the sizeof the first and second apertures h1, h2 according to practicalsituations. Accordingly, by modifying the number, the position, and thesize of the aperture formed on the shielding elements 120, the influxand the wavelength of the light received by the sensor chip 11 can beadjusted.

Please refer to FIG. 6 and FIG. 7. FIG. 6 shows a top view of an opticalsensor package module in accordance with another embodiment of theinstant disclosure. FIG. 7 shows a sectional view taken along lineVII-VII of FIG. 6. In the instant embodiment, the shielding element 120and the frame 121 of the shielding assembly 12 are integrated as onepiece. Specifically, the shielding element 120 has a main portion 120 aand a protruding portion 120 b. The main portion 120 a is embedded inthe top plate 121 a of the frame 121.

Furthermore, the protruding portion 120 b protrudes from the edges ofthe frame 121 defining the light receiving opening 121 h for limitinginflux of light onto the sensor chip 11. More specifically, theprotruding portion 120 b is in an annular shape and extends radiallyinward from the edges of the frame 121 to a geometric center of thelight receiving opening 121 h. The first aperture h1 is defined by theprotruding portion 120 b, as shown in FIG. 6 and FIG. 7

Notably, when the thickness of the shielding element 120 is thinner than200 μm, the mechanical strength of the shielding element 120 is notstrong enough. Accordingly, in the instant embodiment, the shieldingelement 120 and the frame 121 are engaged with each other to improve amechanical strength of the shielding assembly 121.

In one embodiment, the shielding assembly 12 of the instant embodimentcan be fabricated by the following steps. The shielding element 120having the first aperture h1 can be formed by etching or punching ametal sheet. Subsequently, the frame 121 is formed by an insertinjection molding process with the shielding element 121 being aninserted component during the insert injection process. Notably, theprecision of the first aperture h1 is required in the optical sensorpackage module 1. The shielding assembly 12 formed by the abovementionedprocesses can result in higher precision during the fabrication of theshielding element 120.

Please refer to FIG. 8. FIG. 8 shows a sectional view of the shieldingassembly in accordance with another embodiment of the instantdisclosure. The shielding assembly 12 shown in FIG. 7 can also bereplaced with the shielding assembly 12 shown in FIG. 8. In the instantembodiment, the protruding portion 120 b has a larger thickness at oneend portion connected to the main portion 120 a than that at the otherend portion defining the first aperture h1. That is to say, in theembodiment shown in FIG. 8, the thickness of the protruding portion 120b gradually decreases in the inward radial direction.

To sum up, the optical sensor package module 1 in accordance with theinstant disclosure can control a ratio between the influx of a signallight of a wavelength within a predetermined wavelength range and theinflux of the stray light by disposing the shielding assembly 12, theshielding assembly 12 having at least one aperture to expose the subset110 a of pixels that is configured to receive the signal light. As such,most stray light, such as the ambient light, can be blocked by theshielding assembly 12 and the signal-to-noise ratio of the opticalsensor package module 1, 1′ can be increased.

In addition, the shielding element 120 is not formed on the sensor chip11 during the wafer fabrication process of the sensor chip 11. To bemore specific, the shielding element 120 of the shielding assembly 12 isdisposed on the sensor chip 11 after the wafer dicing process. It isworth noting that if a shielding layer is formed by CVD or PVD duringthe wafer fabrication process of the sensor chip 11, the production costwill be high. Therefore, with the shielding assembly 12 being disposedon the sensor chip 11 after the wafer dicing process, the productioncost can be reduced and the exposed subsets of the pixels of the sensorchip 11 and the range of wavelength to be detected by the subset ofpixels can be determined according to actual needs.

The descriptions illustrated supra set forth simply the preferredembodiments of the instant disclosure; however, the characteristics ofthe instant disclosure are by no means restricted thereto. All changes,alterations, or modifications conveniently considered by those skilledin the art are deemed to be encompassed within the scope of the instantdisclosure delineated by the following claims.

What is claimed is:
 1. An optical sensor package module comprising: asubstrate; a sensor chip disposed on the substrate and including anarray of pixels located at a top side thereof for receiving light; and ashielding assembly disposed on the substrate and surrounding the sensorchip for limiting influx of light onto the sensor chip, wherein theshielding assembly includes a shielding element disposed on the sensorchip by an adhesive structure, and the shielding element has a firstaperture to expose at least a first subset of the pixels that isconfigured to receive corresponding light; wherein the adhesivestructure is an adhesive layer disposed between the sensor chip and theshielding element and having a through hole to expose the first subsetof the pixels, the through hole corresponding to the first aperture. 2.The optical sensor package module according to claim 1, wherein awavelength of the corresponding light falls within a first predeterminedwavelength range.
 3. The optical sensor package module according toclaim 2, further comprising a first light-emitting component foremitting light of a wavelength within the first predetermined wavelengthrange, the first light-emitting component being disposed on thesubstrate.
 4. The optical sensor package module according to claim 1,further comprising a first light-emitting component disposed on thesubstrate, wherein the shielding assembly includes a frame disposed onthe substrate, wherein the frame includes a top plate and a partitionwall extending downward from the top plate for separating the sensorchip from the first light-emitting component, and the top plate has alight receiving opening in alignment with the sensor chip.
 5. Theoptical sensor package module according to claim 4, wherein theshielding assembly further includes a shielding structure, the shieldingstructure together with a part of the partition wall forming a spacethat accommodates the first light-emitting component.
 6. The opticalsensor package module according to claim 5, wherein the shieldingelement has a second aperture to expose a second subset of the pixelsreceiving light of wavelength within a second predetermined wavelengthrange.
 7. The optical sensor package module according to claim 6,wherein the second predetermined wavelength range and the firstpredetermined wavelength range partially overlap or do not overlap. 8.The optical sensor package module according to claim 6, wherein a sizeof the first aperture is different from that of the second aperture. 9.The optical sensor package module according to claim 6, furthercomprising a second light-emitting component for emitting light of awavelength within the second predetermined wavelength range, the secondlight-emitting component being disposed on the substrate andaccommodated in the space.
 10. The optical sensor package moduleaccording to claim 1, wherein the adhesive structure has a plurality ofsubstructures separated from each other, the substructures not coveringthe first subset of the pixels.
 11. The optical sensor package moduleaccording to claim 1, wherein the adhesive structure is made of amaterial with Young's modulus of less than 2000 MPa.
 12. The opticalsensor package module according to claim 1, wherein the shieldingelement is a metal sheet, and a thickness of the shielding elementranges from 20 to 250 μm.
 13. The optical sensor package moduleaccording to claim 1, wherein a diameter of the first aperture rangesfrom 20 to 500 μm.
 14. The optical sensor package module according toclaim 1, further comprising a color filter covering the first set of thepixels.
 15. A manufacturing method of an optical sensor package module,comprising: disposing a sensor chip on a substrate, the sensor chipincluding an array of pixels located at a top side thereof for receivinglight; and forming and disposing a shielding assembly having an apertureon the substrate to cover the sensor chip, wherein the aperture is inalignment with the sensor chip to expose at least a first subset ofpixels that is configured to receive corresponding light; wherein thestep of forming the shielding assembly includes forming a shieldingelement having the aperture by etching or punching a metal sheet. 16.The manufacturing method of the optical sensor package module accordingto claim 15, wherein the step of forming the shielding assemblyincludes: forming a frame having a top plate with an light receivingopening and a partition wall extending downward from the top plate by aninsert injection molding process, with the shielding element being aninserted component during the insert injection process so that a portionof the shielding element is embedded in the top plate and the otherportion protrudes from the edges of the frame and defines the aperture,the edges of the frame defining the opening.
 17. An optical sensorpackage module comprising: a substrate; a first light-emitting componentfor emitting light of a wavelength within a first predeterminedwavelength range, the first light-emitting component being disposed onthe substrate; a sensor chip disposed on the substrate and including anarray of pixels located at a top side thereof for receiving light; and ashielding assembly disposed on the substrate and surrounding the sensorchip for limiting influx of light onto the sensor chip, wherein theshielding assembly includes a shielding element, a frame disposed on thesubstrate, and a shielding structure, the shielding element has a firstaperture to expose at least a first subset of the pixels that isconfigured to receive corresponding light, and a wavelength of thecorresponding light falls within the first predetermined wavelengthrange; wherein the frame includes a top plate and a partition wallextending downward from the top plate for separating the sensor chipfrom the first light-emitting component, the top plate has a lightreceiving opening in alignment with the sensor chip, and the shieldingstructure together with a part of the partition wall form a space thataccommodates the first light-emitting component.
 18. The optical sensorpackage module according to claim 17, wherein the shielding element hasa main portion that is embedded in the frame and a protruding portionthat protrudes from edges of the frame defining the light receivingopening for limiting influx of light onto the sensor chip.
 19. Theoptical sensor package module according to claim 17, wherein theshielding element is disposed on the sensor chip by an adhesivestructure, the adhesive structure is an adhesive layer covering thefirst subset of the pixels and transparent to the corresponding light ofthe first predetermined wavelength range.